Microcontrollers, Microprocessor, FPGA Modules

Manufacturer Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature

Reset All
Apply All
Result

Microcontrollers, Microprocessor and FPGA Modules are embedded computing modules used to provide processing, control, programmable logic and system integration functions in electronic designs. They are widely used in industrial control, automation equipment, communication devices, IoT products, robotics, medical electronics, automotive electronics and embedded system development.

This category includes microcontroller modules, microprocessor modules, FPGA modules, system-on-module solutions, embedded processor boards, programmable logic modules and related development or production-ready modules. These products are commonly selected based on processor type, logic capacity, memory support, interface options, operating voltage, package format, temperature range and application requirements.

TomatoElec supplies original Microcontroller, Microprocessor and FPGA Modules from recognized electronic component manufacturers and trusted supply channels. As an in-stock electronic components supplier and independent distributor, TomatoElec provides inventory support, original component sourcing and BOM sourcing services for global customers.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0745-02-91C31-A

TE0745-02-91C31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0 -
RFQ
TE0745-02-91C31-A

Datasheet

TE0745 Bulk Obsolete MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-4BE21-A

TE0817-01-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -
RFQ

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA

IW-G30M-C4CG-4E002G-E008G-BIA

ZU4CG (-1 Speed) MPSoC SOM

iWave Global

1 -
RFQ
IW-G30M-C4CG-4E002G-E008G-BIA

Datasheet

Zynq® UltraScale+™ Bulk Active MPU, FPG ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) ARM® Mali 400 MP2 1.5GHz, 600MHz 8GB eMMC 4GB, 1GB 2 x 240 Pin 4.330" L x 2.950" W (110.00mm x 75.00mm) -40°C ~ 85°C
TE0820-05-4DI81MA

TE0820-05-4DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Active - - - - - - - - -
TE0807-03-4BE21-A

TE0807-03-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -
RFQ
TE0807-03-4BE21-A

Datasheet

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0807-03-4BE21-AK

TE0807-03-4BE21-AK

MPSOC MODULE TE0807 WITH ZYNQ UL

Trenz Electronic GmbH

0 -
RFQ
TE0807-03-4BE21-AK

Datasheet

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-L

TE0808-05-6BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-L

TE0808-05-6BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-F

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Active - - - - - - - - -
TE0808-04-6BE21-L

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

0 -
RFQ
TE0808-04-6BE21-L

Datasheet

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0 -
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

0 -
RFQ
TE0808-04-6BE21-AK

Datasheet

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0807-03-5AI21-A

TE0807-03-5AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

0 -
RFQ
TE0807-03-5AI21-A

Datasheet

- Box Active - - - - - - - - -
MOD5270BXX

MOD5270BXX

IC MOD COLDFIRE 95MHZ 2.064MB

NXP USA Inc.

0 -
RFQ

-

- Bulk Obsolete MCU, Ethernet Core ColdFire 5270 - 95MHz 512KB 2.064MB RJ-45, 2x50 Header 2.600" L x 2.000" W (66.04mm x 50.80mm) 0°C ~ 70°C
Total 1397 Record«Prev1... 2829303132333435...70Next»
TomatoElec

Search

TomatoElec

Products

TomatoElec

Phone

TomatoElec

User